Rhonda Franklin Drayton
Associate Professor

B.S., 1988, EE, Texas A&M University, College Station, TX
M.S., 1990, EE, University of Michigan, Ann Arbor, MI
Ph.D., 1995, EE, University of Michigan, Ann Arbor, MI

Telephone: (612) 626-8978

E-mail: drayton@ece.umn.edu
Web Page: http://www.ece.umn.edu/groups/mpact/


My research interests focus on exploring the use of silicon micromachining (MEMs) in radio frequency (rf) and microwave applications related to wireless, mobile and satelitte communication systems. In particular, emphasis is directed toward novel design, fabrication, and testing methods of planar circuits and antennas, such as microstrip, as well as package technology for integrated circuits. I am also interested in exploring the use of advanced micromachined packages and interconnects in photonic and high speed electronic (also referred to as rf/microwave photonic) applications. My educational interests focus on offering a diverse learning experience to future rf and microwave engineers through traditional classroom training, practical CAD design, hands-on laboratory experiences and research opportunities. Web-based learning methods and multidisciplinary approaches are also explored that offer broader training and understanding of how applied electromagnetics fundamentals relate to applications in the communications field.


Selected Publications

"Monolithic packaging concepts for High Isolation in Circuits and Antennas", R. F. Drayton, R.M. Henderson, and L.P.B. Katehi, IEEE Trans. Microwave Theory and Techniques, vol. 46, no. 7, pp. 900-906, 1998

"Micromachined Patch Antenna", I. Papapolymerou, R.F. Drayton, and L.P.B. Katehi, IEEE Trans. Antennas and Propagation, vol. 46, no. 2, pp. 275-283, 1998

"High Frequency Circuit Components on Micromachined Variable Thickness Substrates", R. F. Drayton, R.M. Henderson and L.P.B. Katehi, IEE Electronics Letters, vol. 33, no. 4, pp. 303-304, 1997

" Development of Self-Packaged High Frequency Circuits Using Micromachining Techniques", R. F. Drayton and L.P.B. Katehi, IEEE Trans. Microwave Theory and Techniques vol. 23, no. 9, pp. 2073-2080, 1995

"Development of Self-Packaged High Frequency Circuits Using Micromachining Techniques," R. F. Drayton, T.M. Weller, and L.P.B. Katehi, The ISHM Int'9l Journal Microcircuits and Electronic Packaging, vol. 18, no. 3, Third Quarter, pp. 217-224, 1995