NMAC carries out basic and applied research focused on advanced
nano & microsystems development through interdisciplinary partnerships
between academic faculty and industrial/government researchers.
• Integrated MEMS/NEMS and Nano-Enabled Devices
• BioMEMS, Microfluidics, and Biosensors
• Flexible Electronics and Packaging
• Wireless Sensor Networks
• Low-Power Mixed-Signal Design
• Micro Power Sources
1. Integrated MEMS/NEMS and Nano-Enabled Devices
Value added NEMS/MEMS solutions for mechanical, optical, thermal, wireless, bio, medical applications. Integrated RF MEMS passives, RF MEMS antennas, Optical MEMS devices, uncooled infrared detectors, CMOS integration with NEMS/MEMS microstructures. Integration of new nanostructures such as nanowire, CNT, nanoparticle, magnetic particles, DNA scaffold on microelectronics or microscale platform for functional control and interface.
Faculty: S. Campbell, T. Cui, R. Franklin, H. Jacobs, J. Leger, S. Oh, B. Stadler, J. Talghader
2. BioMEMS, Microfluidics, and Biosensors
Polymer NEMS/MEMS microdevices for bio-interface. Biomedical devices. Cell-microsystem interfaces. Microfluidic components including microvalves, micropumps, microchannels, etc. Understanding of liquid flows in micro and nano-size fluidic channels. Bio-photonics, bio-magnetics, and optical/electrical/magnetic biosensing. Various biosensors for DNA, protein, enzyme, pH, ion, chemical, pathogen, food, odor, environment and health monitoring, especially focused on all-electrical label-free detection.
Faculty:T. Cui, H. Jacobs, S. Kumar, J. Leger, S. Oh, R. Rajamani, S. Saliterman, B. Stadler, J. Talghader
3. Flexible Electronics and Packaging
Disposable polymer circuits and low-cost plastic electronics using flexible substrates. Silicon chips embedded on polymer substrates. Flexible PCB. 3D stacking of multi-layer packaging. RF/microwave signal integrity in flexible 3D packages. Wearable electronics. Bio-compatible hermetic packaging for biomedical devices. Reliable low-cost NEMS/MEMS packaging. Hybrid packaging for SiP and SoP solutions. 3D packaging and integration techniques. Mixed technology (electrical and optical) packaging techniques. Isolation design techniques for planar and 3D design. NEMS/MEMS based packaging solution. Self-assembly packaging.
Faculty: S. Campbell, T. Cui, R. Franklin, H. Jacobs, S. Kumar
4. Wireless Sensor Networks
Distributed sensor deployment with wireless communications. Low-power implementation of network architectures. Adaptable and self-reconfigurable ad hoc networks. Low-power wireless solutions for implanted biomedical devices. Wireless communication through body networks. Wind, solar and vibration energy harvesting for wireless sensor nodes.
Faculty: R. Harjani, C. Kim, R. Rajamani, W. Robbins
5. Low-Power Mixed-Signal Design
Extremely low-power circuit design and chip implementation. Subthreshold analog and digital circuits. Energy recovery logic. Low-power RF CMOS circuit design. Low-noise instrumentation amplifiers. Low-power data converters. Variation-tolerant leakage-suppression circuits. Sensor peripheral and driving/readout circuits. Organic FET circuits. Efficient on-chip power conditioning circuits.
Faculty: R. Harjani, C. Kim
6. Micro Power Sources
Next-generation power generation. Energy-scavenging devices. Bio-energy harvesting cells. Micro fuel cells including DMFC, PEMFC, etc. Micro solar cells. Micro nuclear reactors. Micro electrothermal heat exchangers. Micro reformers, Micro combustors, Micro hydrogen incubators. Battery-less wireless actuation.
Faculty:T. Cui, R. Rajamani, W. Robbins