IEEE Transactions on Circuits and Systems II

(Past TCAS-I Editorial Board)
(Past TCAS-II Editorial Board)

Editorial Board

Editor-in-Chief

Sankar Basu
National Science Foundation
Division of Computing & Communications Foundations
Arlington, VA 22230, USA
Tel: (703) 292 8910
Fax: (703) 292 9059
e-mail: sabasu@cise-nsf.gov

Deputy Editor-in-Chief

· Guanrong Chen

Department of Electronic Engineering

City University of Hong Kong

Tat Chee Avenue, Kowloon

Hong Kong SAR, P. R. China

Tel: 852-2788-7922

Fax: 852-2788-7791

E-mail: gchen@ee.cityu.edu.hk

Associate Editors

N. R. Aluru, University of Illinois at Urbana Champaign, USA, ( aluru@uiuc.edu )

Andreas G. Andreou, Johns Hopkins University, USA, ( andreou@jhu.edu )

Alyssa Apsel, Cornell University, USA, ( apsel@ece.cornell.edu )

Soumitro Banerjee, IIT Kharagpur, India, (soumitro@ee.iitkgp.ernet.in )

Peter Bauer, Notre Dame University, USA, ( pbauer@nd.edu )

Ian M. Bell, University of Hull, UK, (i.m.bell@hull.ac.uk )

Shih-Fu Chang, Columbia University, USA, ( sfchang@ctr.columbia.edu )

Soura Dasgupta, University of Iowa, USA, ( dasgupta@engineering.uiowa.edu )

Mario de Bernardo, Bristol University, UK, ( m.dibernardo@bristol.ac.uk )

Hossein Hashemi, University of Southern California, USA ( hosseinh@usc.edu )

Wing-Hung Ki, Hong Kong University of Science and Technology, ( eeki@ee.ust.hk )

Alexander S. Korotkov, St. Petersburg State Tech. University, Russia ( korotkov@rphf.spbstu.ru )

Alex C. Kot, NTU, Singapore, (EACKOT@ntu.edu.sg )

Francis C.M. Lau, Hong Kong Polytechnic University, ( encmlau@polyu.edu.hk )

Henry Leung, University of Calgary, Canada, ( leungh@ucalgary.ca )

Bernard Levy, University of California at Davis, USA, ( levy@ece.ucdavis.edu )

C. T. Lin, National Chiao-Tung University, Taiwan, ( ctlin@mail.nctu.edu.tw )

Yuan-Pei Lin, National Chiao Tung University, Taiwan, (ypl@cc.nctu.edu.tw )

Jin Liu, University of Texas at Dallas, USA, ( jinliu@utdallas.edu )

Alexander Loui, Eastman Kodak, USA, ( alexander.loui@kodak.com )

Franco Maloberti, U of Pavia, Italy, ( franco.maloberti@unipv.it )

Jorge L. Moiola, Universida Nacional del Sur, Argentina, ( jmoiola@criba.edu.ar )

Sergio Netto, Federal University of Rio de Janeiro, Brazil, ( sergioln@lps.ufrj.br )

Robert Newcomb, University of Maryland, USA, ( newcomb@Glue.umd.edu )

Michael Ohletz, AMI Semiconductor, Belgium, ( michael_ohletz@amis.com )

Sergio Lima Netto, Federal University of Rio de Janeiro, ( sergioln@lps.ufrj.br )

Wolfgang Porod, Notre Dame University, USA, ( porod@nd.edu )

Ruchir Puri, IBM T. J. Watson Research Center, USA, ( ruchir@us.ibm.com )

Eric Rogers, University of Southampton, UK, ( etar@ecs.soton.ac.uk )

Toshimichi Saito, Hosei University, Japan, (tsaito@k.hosei.ac.jp )

Edgar Nelson Sanchez, CINVESTAV Guadalajara, Mexico ( sanchez@gdl.cinvestav.mx )

Gianluca Setti, University of Ferrara, Italy, ( gsetti@ing.unife.it )

Y. Q. Shi, New Jersey Inst. Technology, USA, ( Shi@ADM.NJIT.EDU )

Tajana Simunic, Hewlett Packard Laboratories, USA, ( tajana@csl-mail.stanford.edu )

Mani Soma, University of Washington, USA, ( manisoma@u.washington.edu )

Johan Suykens, Katholieke Universiteit Leuven, Belgium, ( Johan.Suykens@esat.kuleuven.ac.be )

Wallace K. S. Tang, City University of Hong Kong, ( kstang@ee.cityu.edu.hk )

Shuji Tsukiyama, Chuo University, Japan, ( tsuki@elect.chuo-u.ac.jp )

Tetsushi Ueta, Tokushima University, Japan, ( tetsushi@is.tokushima-u.ac.jp )

M. Vidyasagar, Tata Consultancy Services, India, ( sagar@atc.tcs.co.in )

Xiao-Fan Wang, Shanghai Jiaotong University, P. R. China, ( xfwang@sjtu.edu.cn )

Jacob White, Massachusetts Institute of Technology, USA, ( white@MIT.EDU )

Chai Wah Wu, IBM T. J. Watson Research Center, USA, ( cwwu@us.ibm.com )

Xiaohua Xia, University of Pretoria, South Africa, ( xxia@postino.up.ac.za )

Bin Zhao, Skyworks Solutions, Inc, USA ( bin.zhao@skyworksinc.com )

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