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| William J. Gallagher | IBM Watson Research Center | USA |
| Hongsik Jeong | Samsung | Korea | Gurtej Sandhu | Micron | USA |
| Dmitri Nikonov | Intel | USA |
| Romney Katti | Honeywell | USA |
| Akira Goda | Micron Technology | USA |
| Behtash Behin-Aein | GlobalFoundries | USA |
| Jean-Pierre Nozieres | SPINTEC | France |
| Yukihiro Kaneko | Panasonic Corporation | Japan |
| Alex Shukh | Spingate Technology | USA |
| Jian-Ping Wang | University of Minnesota | USA |
| Tetsuo Endoh | Tohoku University | Japan |
| Dorothée Petit | University of Cambridge | UK |
| Takahiro Hanyu | Tohoku University | Japan |
| Andy Kent | New York University | USA |
| Gabriel Molas | Advanced Memory Technology and Innovative Device Laboratory, CEA-LETI-Minatec | France |
| Luping Shi | Tsinghua University | China |
| Stephan Tappertzhofen | Institute of Solid State Research | Germany |
| Dmitri Strukov | University of California, Santa Barbara | USA |
| Xiufeng Han | Institute of Physics, CAS | China |
| Jaakko Akola | Tampere University of Technology | Finland |
| Akihito Sawa | AIST, Japan | Japan |
| I-Wei Chen | University of Pennsylvania | USA |
| Eilam Yalon | Technion | Israel |
| Bin Yu | State University of New York, Albany | USA |
| Gunuk Wang | Rice University | USA |
| Ru Huang | Peking University | China |
| Rong Zhao | Singapore University of Technology and Design | Singapore |
| Kaushik Roy | Purdue University | USA |
| Alexei Gruverman | University of Nebraska-Lincoln | USA |
| Huaqiang Wu | Tsinghua University | China |
| Shigemi Mizukami | Tohoku University | Japan |
| Edwin Kan | Cornell University | USA |
| Xiangshui Miao | Hongzhong University of Science and Technology | China |
| Kang Wang | University of California, Los Angeles | USA |
| ZhiTang Song | Shanghai Institute of Microsystem and Information Technology, CAS | China |
| Christian Binek | University of Nebraska | USA |
| James A. Bain | Carnegie Mellon University | USA |
| Pete Eames | NVE Technology | USA |
| Bin Ma | Fudan University | China |
| Mahendra Pakala | Appliedd Materials | USA |
| An Chen | GlobalFoundries | USA |
| Wei-Gang Wang | University of Arizona | USA |
The 13th Non-Volatile Memory Technology Symposium is sponsored by C-SPIN and technically co-sponsored by The University of Minnesota and IEEE Electron Devices Society.
